00 mm contact wipe on signal pins. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 1. Connector & Configuration Pair Size Product type Columns XCede HD Backplane 3 4 6 8 12 14 24 15 22 30 40 44 Vertical Header Signal Vertical Header Signal Vertical Header Signal Standard Enhanced Enh Gen 2 Vertical Receptacle Power R/A Header Power R/A Receptacle Guide ModuleXCede High Speed / Modular Connectors are available at Mouser Electronics. Rugged Edge Rate® contact system. Brand of Product：Amphenol ICC,Part#：946-210X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. Contact us today for more details of XCede HD, part number 968-4200-A1H. screw length and part number are dependent on daughtercard thickness (as specified from configurator). 00 mm contact wipe on signal pins. BACKPANEL CONNECTORS BACKPLANE CONNECTOR SYSTEM XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. info@xcede. 4 - Four (4) Onboardports by default . 54mm pitch down to 0. 2. Female pin. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. In this category | In this category, (Amphenol) Memory card connector / PCI CCM01 MK5 Series. 7mil Drill Minimum Pad Size vs. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . XCede. For XCede HD RAM. Spacone 5-29-12 XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. BENEFITS. 7mil Drill Minimum Pad Size vs. Specs Kit. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. XCede® connectors also address. Find Parts Learn More. XCede ® HD2 §XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. XCede® connectors also address. XCede. Find Parts Learn More. Motherboard Diagram. XCede ® High-Performance Backplane Connector System. Electrical & Mechanical Models. 2. Choice of 2 or 4 power banks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 40G QSFP+ to QSFP+ AOC Cable. . These connectors are available in 3-, 4- and 6-Pair configurations. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. The connectors are intermatable, electrically and mechanically interchangeable. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Up to 3. 1. 1. 0 TOOLING 1. Login or REGISTER Hello, {0}. 11. Video Library > XCede® HD - Samtec’s High-Density Backplane System XCede® HD - Samtec’s High-Density Backplane System XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 FMC VITA 57. This connector is a single-row, 40-pin, right-angle male header strip that can be cut or broken into smaller strips and is great for low-profile connections. The vertical header range also includes. 2 The daughtercard connector building blocks include signal modules, power modules,. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. C&K Components. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. TARGET MARKETS. The XCede ® HD Plus backplane connector achieves high . Please confirm your currency selection:2. This specification covers the performance, test, and quality requirements for the XCede HD Plus backplane interconnect system. Click OK to extend your time for an additional 30 minutes. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 11. asm jx410-51594_bp. Amphenol Communications Solutions XCede high-performance backplane connector system. 54 - 5. 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. XCede® connectors also. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. See section 4 regarding XHD+ RAM connectors. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede ® HD2 § XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. XCede High Speed / Modular Connectors are available at Mouser Electronics. DETAILS. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. Dislaime Please note that the above information is subject to change without notice. Login or REGISTER Hello, {0}. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. . Wang 2/18/16 C S7764 Updated document title, Added XCede HD2 backplane information B. Features. 08mm. Features. 三个等级的上电次序实现了热插拔. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. We chose the Asus Prime X470-Pro for its inclusion of many modern. performance (up to 28+ Gb/s) in a Hard Metric form factor. These connectors are two-piece devices that connect two printed circuit boards. Sign Up or Register. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. This was soon replaced by DIMM with a 64-bit data path. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. DETAILS. XCede HD2 backplane interconnect system. 4, Gen. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Basics is present with its full range of products to meet the needs of our customers. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. BENEFITS. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. Article: 00229048. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. Part # dimensions for each XCede connector type. 0 DEFINITIONS 4. We would like to show you a description here but the site won’t allow us. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. 0 REFERENCE 2. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. See section 4 regarding XHD2 RAM connectors. Integrated guidance, keying and polarizing side walls available. 1. 00mm: 2 - 54: 1. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. Login or REGISTER Hello, {0}. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. For a 4-pair differential connector per column, 54. Change Location. XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 1. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82 differential pairs/inch. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). 3-, 4- and 6-pair designs. Formed in 2020 by a merger of three well-established organisations — TechStream, Xcede and Etonwood — our mission is to attract the talent that is helping our clients shape the new global economyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1K+ bought in past month. AMPHENOL COMMUNICATIONS SOLUTIONS. 2. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. 6amps per mm. c-jx410-51594 a creo files jx410-51594_bp . Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3. XCede® connectors also address. Formed in 2020 by a merger of three well. These connectors are two-piece devices that connect two printed circuit boards. Mechanical longevity and ruggedness. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersDataspace Connector's data model is designed based on IDS-RAM. See Figure 15 for details. XCede® connectors also address. 60mm (. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Integrated power, guidance, keying and side walls available. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. - FCI. PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 3. 8 mm, Receptacle, Press Fit. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. The company manufactures MIL-DTL-5015, both Front and Rear Release versions, MIL-DTL-83723 Series III, MIL-DTL-28748 rack and panel, Reverse Bayonet, and. Features. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Features & Benefits. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. 3. power connector (J_PWR_B) 7. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. DC Connector Configurations. English. XCede ® HD is a small form factor system with a modular design for significant space savings and. 特色. com. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Change Location. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. 使用Samtec的高速板对板Solutionator®构建您的对接连接器套件 。. The XCede HD connector. Resource The top level of the. refer to tb-2235 for xcede hd product specifications. Page 174 Figure 127. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 80 mm column pitch. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. 384 likes · 6 talking about this · 259 were here. 3-, 4- and 6-pair designs. 1. XCede® connectors also address. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. We offer interconnection systems from 2. XCede® connectors also address. jx410-51594 rev drawing no. - FCI. 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 12 - 48 pairs. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Jump to a Section. Three levels of sequencing enable hot plugging. 4, 6 or 8 columns. 1 DOCUMENTS 2. Contact Mouser (USA) (800) 346-6873 | Feedback. 2. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. the use of advanced engineering polymers in a unique 3-D resonance. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. com. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. High-density backplane system – up to 84 differential pairs per linear inch. Pin header. 4 - Four (4) Onboardports by default . Español $ USD United States. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. 1. Buy Amphenol JX41051436 in Avnet APAC. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® connectors also address. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Role: Data Engineer Salary: up to €95k (DOE) + Benefits Remote Working Policy: Fully remote available Location: Mainz (fully remote) Tech Stack: Spark/Hadoop, Data Lake, AWS/Azure, Python, Kafka, Airflow, Docker, CI/CD. Up to 82 differential pairs per linear inch. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. Amphenol Communications Solutions. +44 (0)203 301 9900. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 99 $ 19. XCede® connectors also address. Integrated power, guidance, keying and side walls available. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. Connectors in the dataspace can handle unified message exchanges by returning data model-compliant responses to data requests. § Differential pairs 28-84 per inch (11-33 differential pairs per10120130-L0J-20DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Left Wall By apogeeweb, 10120130-l0j-20dlf, 10120130-l0j-20dlf datasheet,10120130-l0j-20dlf pdf,amphenol icc (fci)Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. These modules consist of a 12. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. Basics is present with its full range of products to meet the needs of our customers. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. 2. 12 - 48 pairs. XCede® connectors also address. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. 2. 3. 6. FCI. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. 1. 423-0155-500 MOUNTING BLOCK. performance (up to 28+ Gb/s) in a Hard Metric form factor. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. backplane to expander board connector (BP_XCEDE_3) 2. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. 3-, 4- and 6-pair designs. Contact Mouser (USA) (800) 346-6873 | Feedback. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. power connector (J_PWR_A) 6. xcede hd backplane assembly 4 pair connector, leadfree part no. DETAILS. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. XCede® connectors also address. 3. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. EN. 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 XCede HD , XCede HD PLUS & XCede HD2 Daughtercard Customer Use Drawings 2. XCede® connectors also address. 1. 3. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. 54, 3. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. 85 Ω and 100 Ω options. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 2. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions, which enable companies to innovate and grow. Revision “F” Specification Revision Status . 1. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. Features. 4, 6 or 8 columns. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. Wang 6/19/19. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Figure 14: Typical Force vs. FEATURES. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. XCede® connectors also address. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Discover More. connector contacts The COB system satisfies the most various installation needs thanks to the interchangeability of the connector inserts. 5. Connector, XCede HD Series, 100 Contacts, 1. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Login or REGISTER Hello, {0}. 2. 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 80 mm高密度背板垂直插头. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol is one of the leading manufacturers of Connectors. Multiple signal/ground pin staging options. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Available with 40, 60 and 80 signal pins. drwXCede ® connectors also address requirements for high linear signal density at the backplane and daughter card interface. EN. 6. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Features.